| 摘要 |
<p>In a method for rapidly soldering insulated wire to terminal pads of a printed circuit board 5, a soldering tool 32 is electrically heated to a high temperature above 530 DEG C, and preferably between 870 and 1100 DEG C, and has a predetermined effective mass for holding a quantum of heat just sufficient to vaporize the wire insulation and to make an effective solder joint in less than 500 milliseconds over a broad range of terminal pad conditions. Solder may be applied by solder-coating the terminal pads or the wire, by introducing powder or paste into the joint zone, or by use of preforms in the shape of washers, discs or ribbons or use of microdots and microspheres. Electrical heating of the tool 32 may be effected before and/or during tool contact with the wire. <IMAGE></p> |
