Semiconductor capsule mounting clamp

摘要

A reinforcing plate (5) is moulded into the body (4) of a semiconductor capsule mounting clamp (1) so that one surface (7) of the plate is exposed to form a damage-resistant underbody face against which a damping spring (14) reacts to exert a compressive load onto a clamped semiconductor capsule (not shown). The clamp (1) has a generally bridge-like structure moulded in plastics material and having two supporting legs (2, 3) at opposite ends, between which there are wide side apertures permitting transverse positioning of a contact electrode (13) for the capsule.