发明名称 LEAD FRAME
摘要 PURPOSE:To obtain the structure of the lead frame which effectively stops the outflow of resin flowing out from a section between external lead metallic pieces and can remove the metallic section of the lead frame functioning as the stop of the flow without giving a mechanical shock just after the frame is molded with resin when the frame is sealed with resin. CONSTITUTION:A metallic plate 7 worked through punching working as shown in the figure (a) is previously formed in the shape only of an internal lead body up to a section in the vicinity of a resin molding line, and the metallic plate is formed by means of a punching die without being separated from an outer frame 10 left around external lead bodies 8 or a connecting section 11 connecting the frame to sections to which other molding sections are shaped so that metallic sections 9 to be punched among external leads serve as the stop of the flow of resin when the frame is sealed with resin when the external lead bodies 8 are formed as shown in the figure (b). The noses of the metallic sections 9 of the stop of the flow of the resin-that is, end surfaces 13 contacting with the resin molding line 12 shown in a dotted line-are worked so as to be positioned along the molding line or be arranged at positions slightly displaced in the outward direction from the resin mold section.
申请公布号 JPS5895851(A) 申请公布日期 1983.06.07
申请号 JP19810194025 申请日期 1981.12.02
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 ISHIGURO TSUTOMU
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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