| 摘要 |
PURPOSE:To obtain the semiconductor device, which is strong against humidity, vibration, shock, etc. and has excellent environment-resistant property, by forming a package sealing a semiconductor element in double structure. CONSTITUTION:The ceramic package (the first package) 14, on which the element 13 is placed and which seals the element, is encased into another ceramic package (the second package) 15, and sealed by an elastic plastic layer 16 and a lid 26. The element 13 is die-bonded with the first package 14 by gold-silicon eutectic alloy solder, etc., the electrodes 18 of the element 13 and the electrodes 19 of the external extracting leads of the first package 14 are connected by gold wires 20, and the element 13 is placed to the first package, and sealed by a lid 17 made of a metal or a ceramic board, and dried air, etc. are sealed into an air region under the lid 17. |
