| 摘要 |
PURPOSE:To obtain the resin seal type semiconductor device having excellent reliability regarding dampproof property, high-temperature electric characteristics, etc. by using a hargener manufactured by combining polyoxystyrene and novolac type phenol resin and an epoxy resin composition employing an organic phosphine hardening accelerating agent as sealing resin. CONSTITUTION:The composition consisting of the novolac type epoxy resin of 170-300 epoxy equivalent, polyoxystyrene, novolac type phenol resin and an organic phosphine compound is used as the composition for sealing. Molecular weight extending over a wide range can be employed as the molecular weight of polyoxystyrene, but approximately 300-30,000 is preferable from the viewpoint of practicality. It is preferable that the compounding ratio of novolac type phenol resin is within the range of 0.01-100wt.pt. novolac type phenol resin to 1wt. polyoxystyrene. The quantity of the organic phosphine compound compounded may generally be within the range of 0.001-20wt% of resin components (the total amount of epoxy resin and the hardener), but the epoxy resin composition having excellent dampproof property and superior curing characteristics can be obtained especially when the quantity is brought within the range of 0.01- 5wt%. |
