发明名称 COMPRESSION BONDING SYSTEM FLAT PACKAGE TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate the deformation of a copper block, and to leave a center pin as it is by forming a recess section for fixing the pin at the central section of a copper flange and making the plate thickness of the flange thicker than other sections. CONSTITUTION:The device is formed in structure in which the cathode electrode copper block 1 and the copper flange 3 are separated, and a copper disk piece 14 is bonded only to a section, to which a center pin hole 6 is shaped, through braze, etc. and thickness is increased. The cathode electrode copper block 1 is formed in a doughnut-shaped disk, and positioned in the horizontal direction by means of a stage molded to the copper flange 3. Since the electrode copper block 1 and the copper flange 3 are not brazed, thermal deformation is not generated, and excessive processes are unnecessitated.
申请公布号 JPS5893335(A) 申请公布日期 1983.06.03
申请号 JP19810192520 申请日期 1981.11.30
申请人 NIPPON DENKI KK 发明人 KOBAYASHI MAKOTO
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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