| 摘要 |
PURPOSE:To shorten the select time of acceptables or defectives by a method wherein perforations are formed on a perforated tape according to the information in case of the measurement of electric characteristics, the perforated tape is conformed and stacked to a dividing pattern and an adhesive tape is glued onto the perforated tape. CONSTITUTION:Special form chips 12 and defective chips 13 are marked 14 in a probing process. The perforated tape 15 is perforated 16 while being made correspond to the pattern of marking 14 by means of a punching machine as well as the marking 14. The perforated tape 15 is stacked onto the surface of a semiconductor wafer 10 to which dicing is executed while being conformed to the dividing pattern, and the adhesive tape 17 is glued onto the perforated tape. When exfoliating the tape, only special form chips and defective chips are left on the adhesive tape, and acceptables or defectives can be selected for separation. |
