| 摘要 |
PURPOSE:To protect a chip by forming a discontinuous shroud consisting of at least one-layer heat-resistant resin into a region surrounding the section requiring coating of the surface of the chip and coating the inside of the shroud with resin for interrupting radiation. CONSTITUTION:The sroud 4 is shaped to the chip 1 by the heat-resistant resin of a polyimide film, etc. Mechanical stress applied to the surface of the chip due to the difference of thermal expansion coefficients is relaxed because the shroud 4 is formed in broken shape. The inside of the shroud 4 is coated with the silicon resin film 2 shaped through potting. Photosensitive polyimide can also be used as the heat-resistant resin forming the shroud and polyimide as the resin film coating the inside of the shroud. The thickness of the resin 2 shall be the one which can interrupt radiation. |
