| 摘要 |
PURPOSE:To equalize contact resistance for a exact characteristic test and to maintain a contacting tip section clean to reduce abrasion by a method wherein a stage applying vacuum adsorption to a wafer is multiply split and vacuum absorption holes containing respective current driving contacts are provided. CONSTITUTION:A disk-shaped stage 10 is split into fan substrates 11-18 at the center of the stage 10. Vacuum adsorption nozzles 19, vacuum absorption holes 24-31 positioned parallel pins 22 serving as a role of current driving contacts contained with insulating sleeves 20 and push springs 21 in vacuum adsorption nozzles 19 by maintaing space forming vacuum adsorption paths 23, are provided at nearly center of respective substrates. A probe 35 pressed on an emitter 34 is for current driving and is connected to a constant current source paired with the parallel pins 22 in the vacuum absorption hole. A probe 36 is for voltage detection and is connected to a microvoltage measuring voltmeter paired with one split fan substrate 11, and 37 is a microinput current injecting probe for power transistor input. |
