发明名称 Earth contact between substrates which carry stripline circuits
摘要 The invention is based on the object of producing an earth contact between substrates which carry stripline circuits and are arranged on metallic carriers. This object is achieved either in that, in the case of one of two adjacent carriers (7, 9), the substrate (10, 12) projects beyond the edge of the carrier and, in the case of the other (8), the substrate (11) is set back with respect to the edge of the carrier, the projecting substrate part of the adjacent carrier resting on this free carrier region and being made contact with (Figure 2), or in that the carriers (15, 16) are provided with contact surfaces (19, 20) at the sides and are coupled together with these contact surfaces. <IMAGE>
申请公布号 DE3134986(A1) 申请公布日期 1983.06.01
申请号 DE19813134986 申请日期 1981.09.04
申请人 AEG-TELEFUNKEN NACHRICHTENTECHNIK GMBH 发明人 MUECK,KARL,ING.;TEGEL,OTHMAR,ING.
分类号 H05K1/02;H05K1/05;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/02
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