发明名称 PACKAGE FOR FET
摘要 PURPOSE:To improve the band characteristic by the reduction of the input reflection coefficient of a GaAs MESFET, by providing an inductance to a source. CONSTITUTION:The GaAs MESFET chip 6 is mechanically connected to a conductive layer 2 for source electrode, and the source electrode 7, the second gate electrode 8, the first gate electrode 9 and drain electrode 10 are connected respectively to the conductive layer 2 for source electrode, conductive layer 3 for the second gate electrode, conductive layer 4 for the first gate electrode and conductive layer 5 for drain electrode by metallic fine wires 11. Further, a conductive layer 12 for inductance wherein the conductive layer for source electrode is extended is provided.
申请公布号 JPS5892243(A) 申请公布日期 1983.06.01
申请号 JP19810191173 申请日期 1981.11.27
申请人 MITSUBISHI DENKI KK 发明人 IRIE MICHIO;IKI SHIGEO
分类号 H01L29/80;H01L21/338;H01L23/12;H01L23/64;H01L29/812;H01P5/08;H03F3/60 主分类号 H01L29/80
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