| 摘要 |
PURPOSE:To improve the exfoliation strength of terminal parts on a ceramic multi-layer substrate resulting in the improvement of the yield in substrate manufacture, by adopting a metallized pad structue. CONSTITUTION:In a lamination process for a ceramic substrate 1, a ceramic green sheet having the same pattern as the metallized pad 2 and through holes with smaller diameters than pad diameters is laminated by being superposed in the lowest layer, accordingly, a structure wherein metallized pads 2 are completely buried in the ceramic only in the pad periphery is provided after the ceramic calcination, and then plug-in terminals 3 are brazed to metallized pads 2 with concave surfaces by metallic solder 4. Since the metallized pad surface 2 of the ceramic substrate 1 on a receiving jig 6 for brazing is formed in concave surface, the solder 4 is fixed in this concave surface, and accordingly the structure of the jig 5 fixing only terminals 3 is simplified. |
