| 摘要 |
<p>Semiconductor arrangement with at least two semiconductor members having connector conductors cut out of sheetmetal and formed with main surfaces and sectional planes, at least one of the connector conductors having contact surfaces on one of the main surfaces thereof, one side of a respective one of the semiconductor members being mechanically fastened and electrically contacted with the contact surfaces, including a respective support point on one of the other connector conductors, and at least one bond wire, respectively, connecting the other side of the semiconductor members to the respective support points, the bond wires being disposed parallel to one another.</p> |
