APPARATUS FOR SOLDERING SOLDER ON CERAMIC SUBSTRATE

摘要

An apparatus for applying solder to a difficultly solderable substrate comprising a vibration tip which is rotatably mounted on an ultrasonic oscillation mechanism and is slidable in the vertical direction. A needle is placed at a predetermined distance and in a predetermined direction from the edge of said vibration tip and said needle projects to substantially the same level as that of said edge of said vibration tip.