| 摘要 |
PURPOSE:To eliminate the need for the coating of a bonding connecting section with an alpha-rays preventing material by making the angle of contact between at least one part on a semiconductor chip and an alpha-rays preventing material liquid differ from an angle between the liquid and other chip surfaces. CONSTITUTION:The alpha-rays preventing material such as a polyimide film 201 is applied while the angle of contact between one part on the semiconductor chip coated with an insulator and conductor wiring and the liquefied alpha-rays preventing material is made differ from the angle with other chip surfaces. The polyimide film 201 is thermally cured slightly, a wafer is changed into a chip 203, and the chip is mounted onto a base ribbon 204. Polyimide 205 is dropped onto the polyimide film 201 again after bonding. The polyimide is thermally cured completely under the state, and the surface is sealed with molding resin 206. |
