| 摘要 |
PURPOSE:To prevent the deformation of a bonding wire by forming a bonding wire erecting base shaped by an electric insulating material to the fringe of the main surface of a bed. CONSTITUTION:The bonding wire erecting base 5 formed by the electric insulating material is fixed to the fringe of the main surface of the bed 1 by an adhesive layer 6. The erecting base 5 is shaped so as to surround a semiconductor chip 2, and made higher than the height of the semiconductor chip 2. The bonding wire 3 drawn out the electrode of the semiconductor chip 2 to an external lead is placed onto the erecting base 5, and the deformation is prevented. Accordingly, accidents generated through contacts with the bed 1 and the fringe of the chip 2 by the deformation of the bonding wire 3 and short-circuit accidents through the mutual contacts of the bonding wires and the like can be prevented. |
