发明名称 Solderable layer system, its use and method for manufacturing same
摘要 In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.
申请公布号 US4385976(A) 申请公布日期 1983.05.31
申请号 US19820410467 申请日期 1982.08.23
申请人 SIEMENS AG 发明人 SCHUSTER-WOLDEN, HANS;FRELLER, HELMUT;KRUEGER, HANS;WELSCH, WOLFGANG;PEETERMANS, ANDRE;ROELKE, HANS J.;SCHACK, PETER
分类号 C23C14/06;B23K35/00;B23K35/14;G02F1/1345;G09F9/00;H01B13/00;H05K3/24;H05K3/34;(IPC1-7):C23C15/00;G02F1/13 主分类号 C23C14/06
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