| 摘要 |
PURPOSE:To reduce the area of a semiconductor chip by forming a bonding region to the back of the chip. CONSTITUTION:Holes are bored to an active region 1 from the back through etching. The back is oxidized, and oxide films 5 are formed around the holes. Conductors 3 are entered into the holes, and the bonding regions 4 are shaped onto the conductors. Accordingly, the area of the chip is reduced. |
