发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To easily acquire a sufficient brazing strength of wall member without deterioration of electrical and mechanical characteristics of the brazing area and others by providing a brazing material and a metal member which is easily wet thereby at the area on which a wall member abuts. CONSTITUTION:On the occasion of coupling a stad 16 and an insulated wall member 17, for example, by Silver-Copper eutectic brazing material 14, only the brazing area of copper stad 16 is selectively covered with the Ni 15 which is easily wet by the braze 14. According to this constitution, the brazing material 14 does not flow into the inside and reliability of the fitting area of semiconductor element 19 and the junction area of fine lead 20 of gold layer is remarkably improved. In addition, even when a low melting point brazing material is used for fitting element, these are not mixed by melting because diffusion of brazing material for fitting wall member does not occur, element characteristic is stabilized, resulting in various merits on fabrication of a device.
申请公布号 JPS5890749(A) 申请公布日期 1983.05.30
申请号 JP19820076942 申请日期 1982.05.07
申请人 NIPPON DENKI KK 发明人 ANAZAWA SHINZOU
分类号 H01L23/50;H01L21/50 主分类号 H01L23/50
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