| 摘要 |
PURPOSE:To manufacture the semiconductor device with structure in which a defective disconnection mode is difficult to be generated when face mounting by forming the device by a package and a plurality of leads and shaping through- holes or uneven sections to the leads. CONSTITUTION:A plurality of the leads 2 projected from both side surfaces of the package 1 consisting of resin are all projected downward on their midways, and the through-holes 6 are formed to the nose sections of each lead 2, solder welding regions from which solder leaks when mounting. Under a state that the package is mounted to a substrate (a wiring substrate), the nose sections of each lead are fixed to the substrate 4 by solder 5 under a state that the nose surfaces are opposed and placed to the substrate 4. The solder 5 intrudes into the through-hole 6 sections of the leads 2 at that time. Accordingly, contact areas among the leads 2 and the solder 3 are increased, adhesive strength is improved, the leads 2 are not stripped off from the substrate 4, and the defective disconnection mode can be reduced. |
