发明名称 LAMINATED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain the laminated semiconductor device of high reliability by a method wherein the transfer of information between each element of said semiconductor device is performed by means of an optical communication. CONSTITUTION:The information of element layers 2, 4 and 6 is transmitted or received and then transferred by a transmission-reception section 8 using infrared rays, for example, which passes through the element layers 2, 4 and interlayer insulating layers 3 and 5. The transmission and reception part may be located at the same place or located separately.
申请公布号 JPS5887861(A) 申请公布日期 1983.05.25
申请号 JP19810187290 申请日期 1981.11.19
申请人 MITSUBISHI DENKI KK 发明人 MATSUKAWA TAKAYUKI;KOTANI HIDEO;YAMANO TAKESHI
分类号 H05K7/02;H01L27/00;H01L27/06 主分类号 H05K7/02
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