Clutch assembly for removing a severed wafer from an ingot.

摘要

The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture In the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slide for moving the head back and forth and a carriage for vertically moving the head up and down. A motor is used to actuate the carriage while air cylinders are used to actuate the slide and pivot arm assembly.