CURABLE RESIN COMPOSITION

摘要

A curable resin composition is disclosed for use in the manufacture of laminates applied to electronics equipment. The composition essentially comprises a resol type phenolic resin which is obtained from the reaction of an amidated drying oil and a phenol-formal dehyde in the presence of an alkali catalyst. Another form of the composition includes an amidated butadiene polymer to provide improved flexibility and chemicals resistance.