| 摘要 |
A mounting arrangement for high power electronic components consists of a finned heat sink in which the fins run vertically and in which the heat sink is supported by an insulated rod and which is located in a vertically shaped recess formed in the heat sink. One or both ends of the rod are located in open ended slots so that the heat sink on which is mounted a high power electronic component can be withdrawn from a composite assembly without disturbing neighbouring electronic components. <IMAGE> |
