| 摘要 |
<p>PURPOSE:To obtain a semiconductor which has multiple functions and small size by bonding elements of various functions to a polygonal substrate formed with electrode wirings on the respective surfaces. CONSTITUTION:Wirings for connecting between elements are formed in a wiring substrate 1 of a hexahedron, and electrodes are led out from the respective surfaces. The electrodes of an element 2 which has detecting functions of light, heat, sound and pressure, an element 3 which has storing function, an element 4 which has a function for generating light, sound, odor, etc., and an element 5 which has operation controlling function are respectively bonded with solder or the like to the electrodes on the surface of the wiring substrate. The surface 6 which is not used is used for the connection to the base of a sealing package, and the other surface 7 is used for the connection to a heat sink article or other functional element. According to this structure, a semiconductor device which has multiple functions can be very reduced in size.</p> |
