| 摘要 |
<p>PURPOSE:To prevent the oxidation of the soldered part or the part formed with a fillet of a lead pin by rigidly mounting in advance a solder at the part of the pin. CONSTITUTION:A gold solder 2 made of 33.3% Au, 44.5% Ag, 22.2% Cu alloy is sputtered to the soldering surface 1a of the lead pin 1 formed of Fe-Ni alloy. Thus, the oxidation is prevented during stock, the wettability of the solder can be effectively formed, the solder can be readily set on a metallized ceramic substrate 3, and no positon displacement occurs between the lead and the gold solder. Other means for rigidly mounting the pin 1 to the solder 2 such as welding, press-fitting, caulking or the like may be employed in addition to the sputtering.</p> |
