| 摘要 |
PURPOSE:To permit fine connection by a method wherein conductors are formed on one side of a support film in a fine pitch, and a light beam or heat radiation is irradiated near each bonding point between the connection portion and the connecting bump or pattern so as to make connection. CONSTITUTION:A connecting portion 10a of each conductor 10 formed on one side of a support film 11 is superimposed on a corresponding connecting bump 13 on an element 12. Then, each connection portion 10a is pressed by a retaining plate 14 from the other side of the support film 11. In this state, a light beam or heat radiation 16 from a light beam or heat radiation generator 15 is focused and irradiated near a bonding point between the connection portion 10a and the connecting bump 13 from the side of the retaining plate 14, thereby to connect the conductor 10 to the element 12 with fusion. Since both support film 11 and retaining plate 14 are transparent or semi-transparent, the light beam or heat radiation 16 is not absorbed by those members, so that only the desired portions may be heated and fused to make positive connection. |
