| 摘要 |
PURPOSE:To enable to pattern resin of thickness capable of completely shielding against alpha-ray by forming an enclosure of the first resin around a region necessary for coating of the main surface of a semiconductor chip and potting the second resin on the main surface of the enclosure. CONSTITUTION:A heat resisting resin 3 is dropped on the main surface of a semiconductor chip 1. The thickness of the resin 3 is sufficient in the thickness to be etched accurately. Then, the resin 3 is etched as shown to cut a pattern, and when the resin 4 is then potted, the film having the thickness capable of completely shielding alpha-ray by the threshold effect of the surface tension of resin 4 and resin 3' can be obtained. It is preferred to use photosensitive polyimide as the resin 3' and heat resistant polyimide or silicon resin as the resin 4. |
