发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To attain high accuracy, by forming positioning a hole of ceramic package as blind hole, and imbedding a sleeve to the said hole. CONSTITUTION:Holes 2a, 2b fixing a ceramic package 2' to a fitting pin of a fitting main body are made at an upper end of the package 2' fixing a solid- state image pickup element 1, i.e., both ends of a laminated ceramic frame 3 consisting of ceramic frames 3a, 3b forming the open end. In the holes 2a, 2b, a sleeve 9 the inner diameter of which is finished with good accuracy, being a reference hole for the fitting pin with high accuracy, is inserted and imbedded with a silver solder 10. In imbedding and fixing the sleeve 9 to the holes 2a, 2b, after putting in the silver solder 10 in the holes 2a, 2b, the sleeve 9 is inserted, the size is assigned left and right, and up and down from a center shaft C2 of the solid-state image pickup element 1, the sleeve 9 is tentatively fixed by using a tool and fixed with baking.
申请公布号 JPS5884572(A) 申请公布日期 1983.05.20
申请号 JP19810182279 申请日期 1981.11.16
申请人 HITACHI SEISAKUSHO KK 发明人 IWATA YOSHIO;MIYATA KIYOYUKI;FURUNAGA ATSUMI;KADOWAKI MASAHIKO
分类号 H04N5/225;H01L27/14;H01L31/0203;H04N5/335 主分类号 H04N5/225
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