发明名称 SEALING OF THERMOPLASTIC MATTER
摘要 <p>A crack-free seal is formed between adjacent, complementary, thermoplastic solid bodies 4, 5 by placing an electro-magnetically absorptive wafer 3 between the thermoplastic bodies, bringing the bodies into close proximity with the wafer therebetween, and irradiating the wafer and bodies with electro- magnetic radiation at a frequency that only the wafer substantially absorbs. The process is especially useful for sealing wax patterns and gating as part of the lost wax process for producing metal alloy castings. <IMAGE></p>
申请公布号 JPS5884638(A) 申请公布日期 1983.05.20
申请号 JP19820186666 申请日期 1982.10.23
申请人 HAUMETO TAABIN COMPONENTS CORP 发明人 GUREGORII AREN BENEDEIKUTO;ARUBAATO MIRAA ROTSUKUUTSUDO
分类号 B22C7/02;B29C53/00;B29C65/00;B29C65/02;B29C65/14;B29C65/36 主分类号 B22C7/02
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