| 摘要 |
In a semiconductor device, at least two semiconductor components are mounted in an electrically insulated manner on the baseplate of a housing comprising metallic baseplate and insulating upper section and are embedded in insulating material. The baseplate is composed of light metal with a solderable coating. Soldered onto its internal surface is an electrically insulating intermediate disc. For the purpose of mutual support, baseplate and housing upper section have, for example, sections provided for mutual interaction which are appropriately created in the peripheral zone. The housing upper section is sealed with a lid fixed by the latching of projections and has openings for through contact lugs. The housing upper section is provided with perforations for feeding through current supply leads which are mounted on the intermediate disc and which each support a semiconductor chip. At least one current supply lead is formed in the interior of the housing to locate and fix an insulated support point for a contact lug. The perforations in the housing upper section are sealed by slides which are guided by strips and are located by latching to the housing wall.
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