| 摘要 |
A mounting arrangement for a high power electronic component such as a thyristor 1 consists of two finned heat sinks 2, 3 which together sandwich the component between them so as to cool both of its major opposite faces, the two heat sinks being clamped together by means of pressure plates 10 which bear against the outer edges of the heat sink fins 11, 12, 13, so as to form open ended ducts 15, 16, between the pressure plates and the heat sinks. In this way the portions of the heat sinks closest to the component can be effectively cooled by means of a fluid coolant which is made to flow through the ducts. <IMAGE> |
