| 摘要 |
PURPOSE:To contrive an increase in an area effective to the junction of a bonding pad by a method wherein a protruded section corresponding to the beveling portion at the inside of a capillary abutting to the bonding pad is formed at the bonding pad. CONSTITUTION:A bonding pad 4 is formed on a gate oxide film 3 formed on an Si substrate 4 which is of stepped constitution providing a prtruded portion to the beveling portion 7a at the inside of a capillary 7. In this way, an Al oxide layer at the edge portion on the step of the pad 4 is firstly destructed to form a junction and a junction progresses at the flat portion of the central portion of the pad 4 by its infuence. As the result, an area effective to the junction of the pad 4 increases. |
