| 摘要 |
<p>PURPOSE:To obtain a resin for sealing which assures excellent electrical characteristic and moisture proof characteristic from compositions of the novolak type epoxy resin (epoxy equivalent of 170-300), phenol resin and ester phosphite. CONSTITUTION:The bisphenol A type epoxy resin of 50wt% or less is added to the phenol novolak type epoxy resin of epoxy equivalent of 170-300. As a hardener, the novolak type phenol resin is added so that a ratio of a number of phenol hydroxyl groups of phenol resin and a number of epoxy groups of epoxy resin lies in the range of 0.5-1.5. Moreover, the triphenyl phosphite is also added as a hardening accelerator in wt% of about 0.01-20 in resin component and an inorganic bulking agent is added as required 1.5-4 times in weight ratio of a total amount of the epoxy resin and phenol resin hardener. A parting agent is also added and mixed thereto. The resin in such a composition is heated at the time of sealing and hardened. Thereby, a highly reliable resin sealed type semiconductor device can be obtained.</p> |
