发明名称 Method of fabrication of dielectrically isolated CMOS device with an isolated slot.
摘要 <p>A method of fabricating an integrated circuit on a body of semiconductor material having a major surface layer of (110) crystallographic orientation by etching vertical slots into the layer to form distinct islands; depositing dopant species in predetermined ones of the silicon islands so that the major surface and exposed edges of ones of the islands become second conductivity type; and thermally oxidizing the exposed surface portions of the body so that oxide fills the vertical slots between the islands.</p>
申请公布号 EP0078890(A2) 申请公布日期 1983.05.18
申请号 EP19820106907 申请日期 1982.07.30
申请人 ROCKWELL INTERNATIONAL CORPORATION 发明人 SOCLOF, SIDNEY ISAAC
分类号 H01L27/08;H01L21/762;H01L21/8238;H01L29/04;H01L29/78;(IPC1-7):01L21/76;01L21/82 主分类号 H01L27/08
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