发明名称 METHOD OF PRODUCING BOX FOR CONTAINING MORE THAN TWO INTEGRATED CIRCUITS
摘要 Some of the side walls of the integrated circuits (A and B) are made oblique so that they form an angle of approximately 45 DEG with the plane of the integrated circuits. These walls are covered with an insulating layer (3). It is thus possible to form all the connections (C) of the housing simultaneously by the deposition of metal by making, in particular, connections on those side walls of the integrated circuits which have been made oblique and are covered with an insulating layer (3). <IMAGE>
申请公布号 JPS5882555(A) 申请公布日期 1983.05.18
申请号 JP19820187633 申请日期 1982.10.27
申请人 THOMSON CSF 发明人 PIERITSUKU DEESUKURE;JIEENNFUIRITSUPU REBOURU;JIEEN FURAREOU
分类号 H01L23/52;H01L21/48;H01L21/60;H01L23/14;H01L25/065 主分类号 H01L23/52
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