Solder-coating apparatus

摘要

A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member. An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board. Also, the apparatus includes means to move the contacted circuit board through the bath of molten solder as the displaced solder exerts an upward buoyant force against the circuit board.