| 摘要 |
PURPOSE:To allow a high density wiring without increasing the wiring resistance and loss, by utilizing effectively the thickness direction of a substrate resulting in a structure wherein a part of an induction coil is provided on the substrate surface and the remnant in the thickness part of the substrate. CONSTITUTION:All the through-holes 3 are filled with conductor paste, which is dried, and accordingly conductors 7 are formed. Conductor paste is printed on one side surface of the substrate and dried, and accordingly conductors 7 are formed. Conductor paste is printed also on the other side surface of the substrate and dried, and accordingly conductors 7'' are formed. Thereafter, a green sheet wherein this uncalcined induction coil is provided thereon is calcined resulting in a ceramic wiring board wherein the induction coil is provided. |
