| 摘要 |
PURPOSE:To prevent moisture infiltration, by coating at least a part on a surface protection film with a metallic film with the same layer as a bonding pad. CONSTITUTION:Over the entire surface except for the bonding pad 6 on the surface protection film 5, a non-magnetic metallic body the same as the bonding pad 6, e.g. a metallic film 7 constituted of Al is adhesion-formed in approx. the same thickness of approx. 2mum resulting in the constitution in a double protection film structure besides the surface protection film 5. This metallic film 7 is formed by adhesion-forming an Al film in the same process as the formation of the bonding pad 6 and then etching only the periphery of the bonding pad 6 as the insulating part. |
