| 摘要 |
PURPOSE:To facilitate sending a wafer out of a uniformalized etching board by a method wherein a guide groove is provided in the inside peripheral and bottom surfaces of a recessed section provided in the uniformalized etching board in corresponding to the arranged position, the number, the quantity of work of a loading claw and so on. CONSTITUTION:A recessed section 17 so deep that the surface of a uniformalized etching board 12' ranging from its upper end surface 15 to the bottom surface 16 becomes equal to the surface of a cooling board 14 is provided concentrically with a hole made in the board 12' in such a manner that the inside peripheral dimension of the inside peripheral surface 18a is greater than the outside peripheral dimension of a wafer 13 and particularly that the inside peripheral surface 18b equivalent to the thickness of the wafer 13 and shallower than the bottom surface 16 is close to the edge of the wafer. A groove 19 is provided from the surfaces 18a, 18b and that of 16 of the recessed section 17 of the board 12' in corresponding to the arranged position, the number, the working direction and the quantity of work of a loading claw. In so doing, it is possible to facilitate delivering the wafer 13 into the board 12', mounting it on the surface of the board 14, removing it from the surface of the board 14, and sending it out of the board 12' by means of the loading claw. |
