发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To make a mechanism simple by a method wherein a tool is slightly raised in the direction of a wire insertion after the completion of bonding and the wire is vibrated and pulled by a clamper, before being cut. CONSTITUTION:A tool 3 held by an ultrasonic wave oscillating horn 6 is lowered and earthed in a manner as if sandwiching the wire 4 on a pellet 1 and carry out bonding by means of ultrasonic oscillation. After completion of bonding, the tool 3 is slightly raised in the direction of the wire insertion and the wire 4 is held as a clamper 5 is closed. At the same time, because the tool 3 is vibrated by an instant ultrasonic wave oscillation and caused to swing the wire 4, the wire is readily cut. Subsequently, the tool 3 and the clamper 5 are further raised and the neck 4a of the wire 4 is cut. Thus a mechanism for moving the clamper becomes unnecessary so that the mechanism can be simplified. Moreover, there is always a constant quantity of wire feeding out at the tip of the tool when the wire is cut.
申请公布号 JPS5879728(A) 申请公布日期 1983.05.13
申请号 JP19810177737 申请日期 1981.11.05
申请人 SHINKAWA:KK 发明人 HASEGAWA TAKESHI;YAMAZAKI NOBUHITO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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