摘要 |
PURPOSE:To make a mechanism simple by a method wherein a tool is slightly raised in the direction of a wire insertion after the completion of bonding and the wire is vibrated and pulled by a clamper, before being cut. CONSTITUTION:A tool 3 held by an ultrasonic wave oscillating horn 6 is lowered and earthed in a manner as if sandwiching the wire 4 on a pellet 1 and carry out bonding by means of ultrasonic oscillation. After completion of bonding, the tool 3 is slightly raised in the direction of the wire insertion and the wire 4 is held as a clamper 5 is closed. At the same time, because the tool 3 is vibrated by an instant ultrasonic wave oscillation and caused to swing the wire 4, the wire is readily cut. Subsequently, the tool 3 and the clamper 5 are further raised and the neck 4a of the wire 4 is cut. Thus a mechanism for moving the clamper becomes unnecessary so that the mechanism can be simplified. Moreover, there is always a constant quantity of wire feeding out at the tip of the tool when the wire is cut. |