| 摘要 |
PURPOSE:To effectively prevent wirings from being shortcircuited and to easily and inexpensively manufacture a semiconductor device by so forming part of a lead frame as to be higher than the other part near a semiconductor element from the connector of the lead frame with the wirings. CONSTITUTION:A lead frame 31 is so formed as to be higher than the other part by upward bending part of the connector of the frame with wirings 4 near a semiconductor element 1. When molded after the wirings are connected, even if the wirings are fed by the pressure of the resin to cause the wirings 4 to be deformed as designated by a broken line, the wirings 4 are supported by the part of the lead frame 31. Accordingly, a supporting substrate 2 is not possibly shortcircuited with the edge of the element 1 and the wirings 4. The formation of the lead frame is remarkably advantageous by forming the end of the lead frame to be higher than the upper surface of the semiconductor element.
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