发明名称 PACKAGE FOR INTEGRATED CIRCUIT
摘要 PURPOSE:To decrease the number of terminals in the mounting surface in the memory integrated circuit, etc. while reducing noise voltage to a memory circuit due to induced voltage generated in case of the changeover of output currents. CONSTITUTION:The terminals 17 are connected by using pads 19, 19A, 19B formed onto the integrated circuit 13 and metallic wires 15 and electricity is supplied, but one terminal 17A branched is connected to the pad 19A, to which a power supply wire 3 is connected, and the other terminal 17B is connected to the pad 19B, to which a power supply wire 4 is connected. Accordingly, the potential of the power supply wire 17A is constant because branch points approach to a power supply plate in a mounting substrate as the terminals 17 even when induced voltage is generated in the power supply wire 4 through the changeover of output currents.
申请公布号 JPS5878448(A) 申请公布日期 1983.05.12
申请号 JP19820181309 申请日期 1982.10.18
申请人 HITACHI SEISAKUSHO KK 发明人 YAMAGUCHI KUNIHIKO;INADATE MASAAKI
分类号 H01L23/50 主分类号 H01L23/50
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