ARRANGEMENT FOR MOUNTING DUAL-IN-LINE PACKAGED INTEGRATED CIRCUITS TO THICK/THIN FILM CIRCUITS

摘要

TITLE AN ARRANGEMENT FOR MOUNTING DUAL-IN-LINE PACKAGED INTEGRATED CIRCUITS TO THICK/THIN FILM CIRCUITS An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.