RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To improve the moisture resistance and high temperature electric characteristics of a resin-sealed semiconductor device by mixing novolac phenol resin organic phosphine compound and boric acid ester compound as hardener of a novolac epoxy resin with novolac epoxy resin. CONSTITUTION:A resin which covers a semiconductor element is produced by mixing novolac epoxy resin containing 170-300 of epoxy equivalent, and further employing novolac epoxy resin and mixing as hardener a novolac phenol resin having a softening point of 60-120 deg.C and less than 3wt% of water soluble phenol resin content at an ambient temperature. Further, the reaction mixture of organic phosphine compound and boric acid ester compound is added as a hardener accelerator to improve the moisture resistance and high temperature electric characteristics.