| 摘要 |
<p>PURPOSE:To improve the heat sink efficiency of a liquid-cooled semiconductor device by forming a rugged part so as to form the nucleus of coolant boiling on the entire upper surfce of a protective insulating film or substrate covering a semiconductor chip. CONSTITUTION:A protective insulating film 22 made of phosphosilicate glass or the like is formed on the upper surface of a semiconductor chip 21, grooves 23 or 20-50mum wide and approx. 20-50mum deep are formed by an etching method at a pitch of approx. 100mum perpendicularly on the upper surface of the film 22 so that the edge of the groove 23 becomes acute. The chip 21 formed with such film 22 is placed on a ceramic substrate, coolant is sealed therein, and a metal cap is covered, thereby forming a liquid-cooled semiconductor device.</p> |
