| 摘要 |
<p>PURPOSE:To improve the moisture resistance of a resin-sealed semiconductor device using a frame having silver on the surface by containing 0.05-5pts.wt. of silane coupling agent having mercapto group per 100pts.wt of epoxy resin in sealing epoxy resin composition. CONSTITUTION:Phenol novolac epoxy resin is used as epoxy resin composition to seal with resin a semiconductor using a frame having silver at least on the surface, phenol novolac resin is mixed as a hardener, imidazole is mixed as a hardening accelerator, crystalline silica powder is mixed as an inorganic filler, and 0.05-5pts.wt. of silane coupling agent having mercapto group is further contained per 100pts.wt. of epoxy resin. A lead frame 11 is molded with epoxy resin hardener R which is thus produced.</p> |
