| 摘要 |
A semiconductor device having an integrated circuit in an epitaxial layer (2) on a substrate (1), in which the epitaxial layer comprises islands (2A, B, C D) of the conductivity type opposite to that of the substrate (1) which are surrounded laterally by a surrounding region (2E) of the same conductivity type as the substrate. Both the islands and the surrounding region are formed by diffusion from buried layers (3A, B, C, D, E) through the epitaxial layer (2). A bipolar transistor is provided in at least one island. The p-n junctions (4A, B, C, D) between the islands and the surrounding region are substantially at right angles to the surface. The invention also provides a method of manufacturing the device and is of particular importance for realizing very compact and fast circuits with low dissipation consisting of a combination of CMOS and bipolar sub-circuits. |
