| 摘要 |
Copper plating baths include a poly-ether compound containing at least 3 and preferably 6 ether groups and no aliphatic chain exceeding 6 C atoms together with an organic sulphide group which may be linked to an -SO3H group. Alternatively the polyether and the S-compound may be added as separate compounds. The polyethers include polymers of 1:3 dioxolane as described in Specification 1,020,168, preferably of mol. wt. about 5000. They may contain the group (-C2H4OC2H4O-)x where x is 3 or more, or (-C3H6OC3H6O-)y where y is 3 to 10. The S-compounds include thiols, phenyl disulphides, and have present halogen, alkoxy, and other groups. Phenazine dyes may also be added. The copper salt may be sulphate, fluoborate, or a copper alkyl sulphonate or di-sulphonate. The poly-ethers having a terminal OH group form compounds with alcohols, chlorhydrin, nitriles, sulphonic acids, amides, alkanolamines and other compounds. The S-compound when added as a separate compound, preferably has a sulphonic group which may be used as a salt e.g. of triethanolamine, guanidine, ethylene diamine, or pyridine. A range of examples of poly-ethers and S-compounds are given with graphic formulae. In plating iron and steel, a preliminary flash coat of Cu or Ni is desirable. Preferably phosphorized copper anodes are used in the main plating process. |
