发明名称 THERMAL CONNECTING STRUCTURE
摘要 PURPOSE:To increase a supplying and receiving area of heat, and to execute effective heat exchange, by forming innumerably needlelike crystal structures of a metal having satisfactory thermal conductivity, on a heat supplying plane and a heat receiving plane, and meshing and engaging the needlelike crystal structures with each other. CONSTITUTION:On a heat supplying plane 3' of a heat supplying body 1 needlelike crystal structure groups 3 of a metal having satisfactory thermal conductivity are formed innumerably. On the other hand, on a heat receiving plane 4' of a heat receiving body 2, too, needlelike crystal structure groups 4 of the meral having satisfactory conductivity are formed innumerably. As for a metallic projecting body for forming the needlelike crystal structures 3, 4, for instance, when on the regular plating surface of palladium, white gold, rhodium, etc., a palladium needlelike crystal structure is formed by current density about 10 times as high as conventional methods in a plating bath of low concentration of 1/several of a conventional method, forming density is about 2,000-3,000 pieces per 1mm.<2>, the height of the metallic projection is about 100- 150mu, the diameter of the lower surface of the projection is about 20mu, and the ratio of the surface area and the bottom area of the projection is about 10-15 times. In this way, heat is supplied and received efficiently.
申请公布号 JPS5874224(A) 申请公布日期 1983.05.04
申请号 JP19810173216 申请日期 1981.10.29
申请人 AKACHI HISATERU 发明人 AKACHI HISATERU
分类号 B21D39/03;F28F13/00 主分类号 B21D39/03
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